MediaTek is coming with some advanced features in its chipset and setting a revolution in the chipset industry. MediaTek Dimensity 9600, which is the first premium flagship processor which is based on the TSMC 2nm process it also completed its official design tape out stage in September 2025. While looking to this achievement in this earlier stage into the 2nm level with the mass production, while looking to the launch structure for the late next year stage.
While MediaTek hasn’t publicly identified the chip, industry timelines suggest that MediaTek’s next premium SoC will likely carry the name Dimensity 9600 and expand the already established Dimensity 9 premium SoC family. The processor to come is expected to be created with TSMC’s latest 2 nm N2P node, the first node from TSMC to use nanosheet (gate-all-around) transistor architecture, which allows for much greater control of current flow than FinFET designs, as well as greater scaling.
Compared to TSMC’s widely used N3E node, TSMC claims that N2P can achieve about 1.2× greater logic density, as much as 18% greater performance at the same power budget, or around 36% less power consumption at the same performance, which allows chip designers significant tuning flexibility for speed, battery life, or a trade-off. Chip designers can decide to use these ideal efficiencies in flagship SoCs like the Dimensity 9600 in powerful CPU clusters, transitory GPUs, and greater AI accelerators, all without additional thermal or battery implications in mobile devices.
MediaTek has framed this 2 nm transition as a natural evolution of its historic relationship with TSMC. They point to close co-optimization of architecture and manufacturing as the stepping stone to high compute throughput within very stringent power and thermal envelopes, their historical and ongoing value proposition. MediaTek is positioning this platform beyond just premium smartphones into demanding applications such as in-vehicle computing, data center and edge infrastructure, and other high-performance client devices, noting that this is a foundational compute node for more than just a smartphone upgrade cycle, but foundational across several key product lines.
Next year premium flagship competition will be more competitive in terms of processor chipsets with MediaTek Dimensity 9600, Snapdragon 8 Elite Gen 6, and Apple A20 Pro for Apple’s upcoming model iPhone 18 lineup. Looking at the Qualcomm chip, Snapdragon 8 Elite Gen 6 is also working; it is under process, and Apple is expected to come with WMCM packing with A20, while the R2 chip for the vision pro headset and the M6 chip is coming for MacBook.
On the other hand, Samsung is also getting ready with their upcoming chip Exynos 2600, according to several sources says it has started with their production part already, and while their next series Galaxy S26 segment lineup is arriving soon in the market.
Talking to 2nm innovation technology is on its next level, and in the future, it will set a high standard in next-generation chipsets and make a global remark.
